Bonding apparatus

  • Inventors: IIZAKA SUSUMU
  • Assignees: Hitachi Ltd
  • Publication Date: September 19, 1985
  • Publication Number: JP-S60183734-A

Abstract

PURPOSE:To enable the positional correction to be performed with a high precision, by providing a position correcting mechanism with a pair of angle correcting pawls faced to each other and a pair of position correcting pawls faced to each other and having a width different from that of the angle correcting pawls. CONSTITUTION:For correcting the position of a large-sized chip 2, which is carried on a position correcting table, angle correcting tongues 13 are first operated to advance toward the chip 2 so as to hole it between a pair of angle correcting faces. The chip 2 thus held between the angle correcting pawls 13 having a larger width then the chip 2 is position corrected in the rotational direction and the Y direction. Subsequently, position correcting pawls 14 having a width much smaller than the chip are advanced to hold the chip 2 between a pair of position correcting faces. Thus the chip 2 is position corrected in the X direction. Also for correcting the position of a small-sized chip, this position correcting mechanism is operated in the same way. According to this constitution, either small or large chip can be position corrected positively and with high precision.

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Cited By (1)

    Publication numberPublication dateAssigneeTitle
    JP-S6231130-AFebruary 10, 1987Matsushita Electric Ind Co LtdChip bonding device